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Electronics manufacturers allocate a considerable portion of resources to the research and development of Thermal Management solutions. One of the next challenges will be thermal management methods optimization and energy improvement.
The new challenges of electrification
The demands for optimization of electrical components require an ever-greater effort in managing the temperatures of devices and products. Manufacturing companies must maintain optimal temperatures for heat sources so that devices are efficient.
This extends their lifecycle and ensures more suitable operation and reliable, durable performance. Temperature management thus provides valid support to devices, introducing a system that dissipates heat. Techniques implemented inside utilize processes such as conduction, convection, and radiation, regulating the control system.
Proper thermal management would allow electronic equipment, vehicles, power plants, imaging, and computer systems to benefit from ideal performance. Implementing effective thermal management techniques could be the solution to the overheating problem, thereby reducing potential damage. Among the tools offering an immediate solution are heat sinks, fans, liquid cooling systems, and thermal interface materials.
Thermal Management Techniques
Solutions are classified based on the primary cooling method used: air cooling, liquid cooling, and two-phase cooling. Air cooling is the most used because it is economical and has a relatively simple system. Liquid cooling and two-phase solutions offer a more "productive" heat transfer, intended for high-performance applications.
It's worth noting that a significant amount of energy is allocated to cooling systems that power electronic systems. Thus, we might anticipate that electronic systems in the near future will integrate more effective heat dissipation systems. The most significant issues are related to the type of thermal interface material for heat dissipation.
Over time, electronic and mechanical devices have been "miniaturized," meaning reduced in size. This trend has led to an increase in heat flow, and to this day, these devices partly meet thermal requirements. Future systems will undoubtedly see the spread of devices for more effective thermal management. For instance, new projects of heat sinks, materials for heat transfer, and cooling systems like thermoelectric coolers.
The current approaches have pros and cons, often the application's usage conditions guide the most suitable choice.
Solutions for Thermal Management
Each type of electronic system will require a different approach. For air heat dissipation, for example, energy efficiency will find improvement through specific chips and cooling systems. For liquid-cooled electronic systems, the focus is on a significant improvement not only in component and chip performance. But especially on a considerable reduction in operational and maintenance costs, and achieving thermal noise and acoustic requirements.In the field of precision air conditioning, there are many devices and control systems to face every challenge with the right tools. For heat management, there are:
- Solutions for container and cabinet air conditioning, to manage the thermal densities of IT equipment even in remote locations.
- Efficient heat dissipation systems like condensers and dry coolers.
- Room air conditioning, for aisles and racks, systems optimized to maximize efficiency without performance loss.
- Easily installable chillers.
- Thermal control and monitoring systems.
Heat dispersion, in addition to improving the efficiency of electronic equipment, allows extending their lifecycle. At Priver, our team of experts is ready to offer consultancy to find the most suitable product for your applications and guide you towards the right choice.